|
Actives, Optics, Passives Components
Includes transistors, FETs (field effect transistor), diodes, rectifiers,
crystals, oscillators, fiber optic transceivers and cables, inductors,
ferrites, capacitors, magnetics, circuit protection devices, relays,
switches and resistors.
Russell Shimp
shimp@lenovo.com
Electronic card assemblies
The finished product that a contract manufacturer (CM) ships to Lenovo. CMs take a printed circuit board (or raw card), places components on it (such as AOP (actives/optics/passives), logic, etc.), then test the assembled product per its requirements prior to shipping to a Lenovo plant (or in some cases, another CM) for assembly into one of our products (Thinkpad, Thinkcentre, etc.).
Don Bai
baidb@lenovo.com
Electronic components
Russell Shimp
shimp@lenovo.com
Liquid crystal display (LCDs)
Glass and electronics, thin film transistor
technology.
Annie Wang
anniew@lenovo.com
Katsutomi Nagai
nagai3@lenovo.com
Visual (LCD/CRT Monitor)
Annie Wang
anniew@lenovo.com
Logic-standard and custom
Application specific integrated circuit (ASIC), programmable logic devices/field programmable gate arrays (PLD/FPFG), linear-analog devices-power/thermal management, voltage regulation, audio, vendor transistor logic (VTL), timing solutions-clocks, frequency synthesizers, micros-microcontrollers, application specific standard products, networking, and communications.
Russell Shimp
shimp@lenovo.com
Communications/Networking Devices
(Wireless LAN, Wired LAN, Bluetooth, WIMAX, 3G Wireless WAN, Modem WAN)
Salim Chowdhury
salimchow@lenovo.com
Mechanical parts
Made up of parts and assemblies from fabricated metal, injection molded plastic, machined operations, and castings. Examples of parts/assemblies which are part of this commodity's responsibility are: frames, covers, chassis, brackets, HDD (hard disk drive) trays, CEC (central electronic complex) cages, and rack slides/kits.
Notebook: Ichiroh Arimura
arimura@lenovo.com
Desktop: Qingsong Wang
wangqsa@lenovo.com
Memory
Memory semiconductor is used to store data electronically.
Brad Condon
bcondon@lenovo.com
OEM (original equipment manufacturing)
TThinkPad (mobile) and ThinkCentre (desktop), personal computers manufactured by OEM/ODM (original equipment manufacturing/object data manager) suppliers on behalf of Lenovo.
OEM Notebook: Kazu Nakamura
kazusan@lenovo.com
OEM Desktop: Jeffrey Bolte
boltej@lenovo.com
Power and thermal devices
The current power supply market is typically divided into three segments: OEM (original equipment manufacturing), telecommunications, and uninterruptible power supplies (UPS). The OEM segment includes mainly AC/DC (alternating current/direct current) power supplies and DC/DC (direct current/direct current) converters which power electronic equipment--primarily information technology-related equipment.
Notebook Thermal Devices: Ichiroh Arimura
arimura@lenovo.com
Notebook Power/Expansion: Kaz (Kazuo) Takebe
ktakebe@lenovo.com
Hard Disk Drives HDD (hard disk drive)
Hongchang Zhou
zhouhc@lenovo.com
Optical/Floppy Drives (ODD/FDD)
Charles Chai
Chcai@lenovo.com
Think Server and Workstation
Damon Holt
holtd@lenovo.com
Sure Server
Cindy Zhang
zhangweit@lenovo.com
Logistics
All shipment modes of air, ocean and ground transportation worldwide, as well as antecedent services such as third party logistics, warehousing and storage, freight bill payment,records retention and vital records retention and management, tape media migrations, inventories and audits.
Josh Skeen
jskeen@lenovo.com
|
